Cross Section Polisher
Nanotechnology Research Facility
Equipment
Specifications
- JEOL (SM-09010).
- Cross-section polishing using ion beam milling.
- Pressure gauge: penning type.
- An optical microscope for specimen positioning.
- Controls for the vacuum system.
- Accelerating voltage: (Acc. V.): 2 -- 6kV
- Cross-Section Area: 500µm width.
- Etching Speed: 1.3µM/min 100µm from Si edge.
- Specimen Size: 15 x 9 x 6mm largest sample option
- Specimen movement range: 3 ± mm (X & Y axes) - Specimen tilt range: ± 5°.
Principles
The specimen stage in the chamber features a holder and shield plate. The specimen is placed in the holder, and the region of the sample to be cross-sectioned is selected under the optical microscope. After evacuating the specimen chamber, a broad argon ion beam irradiates the surface of the specimen partially masked by a shielding plate. Thus, the region that is not masked by the shielding plate is etched. During milling, the specimen stage can be automatically rocked ± 30° to prevent beam striations and insure uniform etching of composite materials with different hardness, preventing the soft portions from being cut faster than the hard portions.Capabilities
- Offers high quality cross-sections of soft and hard materials.
- Minimum strain and distortion of the polished surface.
- Large cross-section areas (1.5 mm wide and several hundreds of microns deep).
- No particle embedding in the polished surface.
- Low running cost.
- Ease of operation.
- No wastewater or chemical.
- Friendly to environment.
Applications
- Gold wire Bond.
- Galvanized Coating.
- Fiber Optics.
- Thin Film Analysis