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Cross Section Polisher

Nanotechnology Research Facility
Equipment
Cross Section Polisher

Specifications

  • JEOL (SM-09010). 
  • Cross-section polishing using ion beam milling. 
  • Pressure gauge: penning type.
  • An optical microscope for specimen positioning. 
  • Controls for the vacuum system. 
  • Accelerating voltage: (Acc. V.): 2 -- 6kV 
  • Cross-Section Area: 500µm width. 
  • Etching Speed: 1.3µM/min 100µm from Si edge. 
  • Specimen Size: 15 x 9 x 6mm largest sample option 
  • Specimen movement range: 3 ± mm (X & Y axes) - Specimen tilt range: ± 5°.

Principles

The specimen stage in the chamber features a holder and shield plate. The specimen is placed in the holder, and the region of the sample to be cross-sectioned is selected under the optical microscope. After evacuating the specimen chamber, a broad argon ion beam irradiates the surface of the specimen partially masked by a shielding plate. Thus, the region that is not masked by the shielding plate is etched. During milling, the specimen stage can be automatically rocked ± 30° to prevent beam striations and insure uniform etching of composite materials with differ­ent hardness, preventing the soft portions from being cut faster than the hard portions.

Capabilities

  • Offers high quality cross-sections of soft and hard materials.
  • Minimum strain and distortion of the polished surface.
  • Large cross-section areas (1.5 mm wide and several hundreds of microns deep).
  • No particle embedding in the polished surface.
  • Low running cost.
  • Ease of operation.
  • No wastewater or chemical.
  • Friendly to environment.

Applications

  • Gold wire Bond.
  • Galvanized Coating.
  • Fiber Optics.
  • Thin Film Analysis